Ultrafine Aluminum Hydroxide

Ultra fine Aluminum Hydroxide (UFAH) is a sub micron/nanometer level inorganic functional material (chemical formula Al(OH)₃）prepared by an integrated process of "seed induced nucleation+air flow crushing and classification". The core particle size is controlled in the range of 0.1μm-2.0μm, and the specific surface area reaches 8-50m ²/g, far exceeding conventional aluminum hydroxide (<5m ²/g). Ultra fine aluminum hydroxide completely breaks the industry pain point of "high filling=mechanical performance degradation", and is widely used in high-end fields such as new energy vehicles, 5G infrastructure, semiconductor packaging, etc. It is an indispensable core supporting material for high-end manufacturing.

Core strengths

1. Precise control of submicron particle size: balancing efficiency and processability

Breaking through the bottleneck of wide particle size distribution (Span value>1.5) in traditional processes, adopting the "AI intelligent grading+crystal structure optimization" technology to achieve three major breakthroughs:

-Particle size customization: covering the entire range of nanometer level (D50=0.1-0.5μm), submicron level (D50=0.5-1.0μm), and fine level (D50=1.0-2.0μm), with batch CV value ≤ 3.5%, far better than the industry average of 7.8%;

-Narrow distribution design: Span value ≤ 1.0, D90/D10≤2.8， Avoiding processing defects caused by agglomeration of large particles, achieving a dispersion uniformity of 98% in the polymer matrix;

-Low filling and high flame retardancy: Nano grade products can achieve UL94 V-0 grade with a minimum addition of 32% in EVA cable materials, reducing the filling amount by 25% compared to conventional products and significantly preserving the mechanical properties of the substrate.

2. In situ composite modification technology: solving the pain points of interface compatibility

Innovatively developing a "silane/titanate+lubricant" composite modification system to achieve oleophilic coating of ultrafine aluminum hydroxide, achieving:

-Improved interface adhesion: The water contact angle has been increased from the original 20-30 ° to 90-115 °, the moisture absorption rate is ≤ 0.15%, and the compatibility with substrates such as PP, epoxy resin, and rubber has been improved by 50%;

-Processing performance optimization: Melt flow rate (MFR) increased by 23%, extrusion scrap rate reduced to below 0.8%, suitable for multiple processes such as injection molding, extrusion, coating, etc;

-Function expansion: Customizable flame retardant+high thermal conductivity (thermal conductivity ≥1.2W/(m·K)), flame retardant+low dielectric (ε≤ 3.0) composite function, suitable for special scenarios such as new energy and 5G.

3. High purity and low impurity control: Suitable for high-end scenarios with strict requirements

In response to the extreme requirements for impurities in the electronic and semiconductor fields, the "gradient precipitation+ion exchange" purification process is adopted:

-Main content ≥ 99.95%:Al(OH)₃ purity reaches 99.95% -99.99%, Al₂O₃ content ≥ 64.5%, Fe₂O₃≤50ppm, Na₂O≤20ppm, SiO₂≤30ppm, far superior to industry standards;

-Low conductivity characteristics: resistivity ≥ 10 ¹⁰Ω· m, chloride ion content<10ppm, meeting the insulation requirements of semiconductor packaging and high-frequency communication equipment;

-High whiteness standard: L value ≥ 95, some high-end models reach 97 or above, suitable for the appearance requirements of home appliance shells and building decoration materials.

4. Green closed-loop production process: in line with the dual carbon strategy

Constructing a "low alkali precipitation+closed-loop water circulation" production system to achieve sustainable development:

-Energy consumption optimization: The comprehensive energy consumption per ton of product has been reduced to 1.35 tons of standard coal, a 25% decrease compared to traditional processes, and a 30% reduction in carbon emissions;

-Resource recycling: The reuse rate of production wastewater is ≥ 95%, and the recovery rate of red mud by-products reaches 72%, which meets the requirements of circular economy;

-No harmful emissions: The production process has no VOC or heavy metal emissions, and has passed the highest level certification of ISO 14001 environmental management system.

Application scenarios

1. New energy vehicles and power batteries

-Application scenarios: power battery diaphragm coating, battery pack insulation layer, charging gun cable, lightweight interior;

-Core value: Nano level products have passed thermal runaway diffusion testing, with stable performance in a wide temperature range of -40 ℃~120 ℃. The usage of a single power battery pack reaches 3.2kg, an increase of 2.1 times compared to 2020; Thermal conductivity grade models have a thermal conductivity of ≥1.2W/(m·K), effectively reducing battery temperature rise;

2. 5G infrastructure and electronic and electrical systems

-Application scenarios: 5G base station casing, high-frequency copper-clad laminate (LTCC substrate), data cables, electronic packaging adhesive;

-Core values: Low dielectric constant (ε=2.8-3.0), low loss factor, meeting the high-frequency transmission requirements of 5G, with a sphericalization rate of>90% for products with particle size ≤0.5μm, suitable for the machining accuracy requirements of precision electronic components;

3. Semiconductor packaging and high-end manufacturing

-Application scenarios: Semiconductor CMP polishing solution, electronic ceramics, LED packaging adhesive;

-Core value: 99.99% high purity, Fe≤30ppm、Na≤15ppm， Chloride ion<10ppm, meets SEMI semiconductor material standards, achieves atomic level flatness in 12 inch silicon wafer polishing;

4. Green buildings and rubber products

-Application scenarios: A-level fireproof coatings, flame-retardant insulation boards, PVC flooring, rubber conveyor belts;

-Core values: high whiteness (≥ 95%), low smoke toxicity, in compliance with GB/T 2408-2021 building fire prevention standards, reducing CO emissions by 30% in fires, and maintaining good flexibility even with a filling amount of 60% in rubber products.

Frequently Asked Questions (FAQ)

Q1: What is the difference between ultrafine aluminum hydroxide and conventional aluminum hydroxide?

A: Difference: ① Particle size: Ultra fine aluminum hydroxide D50≤2μm, uniform particle size distribution, while conventional aluminum hydroxide D50 is mostly above 5 μ m; ② Dispersibility: Ultra fine aluminum hydroxide is easily dispersed without agglomeration after anti agglomeration treatment, while conventional aluminum hydroxide has poor dispersibility and is prone to product defects; ③ Adaptability: Ultra fine aluminum hydroxide can be used for transparent, precision high-end products, while conventional aluminum hydroxide is only suitable for ordinary rubber, building materials and other fields.

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